[2025-01-18] For better promotion of the events, the categories in this system will be adjusted. For details, please refer to the announcement of this system. The link is https://indico-tdli.sjtu.edu.cn/news/1-warm-reminder-on-adjusting-indico-tdli-categories-indico
点击链接入会,或添加至会议列表:
https://cern.zoom.us/j/4042031778
ZZy:
Next:
Geometric simplification was implemented as a troubleshooting step to identify previous numerical anomalies.
The simulation was configured to reflect the following experimental parameters:
Forced Convection: An inlet air velocity of 5ms^-1 was applied to the enclosure.
Heat Load (Active Components):
Chips: Each of the 9 chips was assigned a power dissipation of 1.55W
SiPM Sensors: The SiPMs were set to a power load of 1mW
The ansys simulation shows there is thermal diffusion from the chips to pcb but it yielded extreme temperatures ranging from -4.4C to 500C.
The COMSOL simulation shows a more reasonable thermal distribution (approx 30C to 170C).


[Today's foucus:]
[Next plans:]
Today's focus:
[ssWW]:


Plans:
[ssWW]:
[Hyy*]:
[Zbbj Calibration]:
DarkSHINE:




STCF EMC:


Plan:
DarkSHINE:
STCF EMC:
DarkSHINE
Today's focus:
[Hyy*]:
Immediate Plans:
Weekly Summary:


(A small test to see if it works.
Next_Plan:
Today's focus:
[STCF]:


Plans:
[STCF]: